2D BGA Inspection

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PI-1000B 2D BGA Inspection System

Overview

PI-1000B 2D is an inspection system for measurement of 2D Ball Grid Arrays

Feature

  • Simple setup
  • Easy calibration procedure.
  • Defects images log. Up to 10 defects images will be saved.
  • Inspects up to two thousand solder balls per second.
  • Handles a variety of BGA, CSP, and flip chip device types

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